Marposs strengthens its presence in the semiconductor and consumer electronics segments with its key showcases at SEMICON INDIA 2024 at Hall 8, Booth D16. The event aimed at ‘Shaping the Semiconductor Future’ is scheduled for September 11-13, 2024, at India Expo Mart (IEML), Greater Noida, Delhi NCR, and co-located with electronica India and productronica India.

The Group understands that placing and maintaining a process under control is the key factor for any production. This is even more true for the very demanding semiconductor and semiconductor-like manufacturing processes, which can be considered some of the most complex ones, that require the control of an increasing number of parameters. Not to forget that a semiconductor is a brittle and hard material that requires dedicated machine tools to slice, lap, thin, get intelligent, and finally cut the die.

In order to improve and maintain high yield, inspection and metrology are key factors. They are also crucial for the management of the semiconductor manufacturing process to find defects on both patterned and unpatterned wafers.

Marposs engineers are ready to support the customers in defining how to improve the performances of automatic machines used during wafer processing and the front-end and back-end fabrication steps. Also, the company offers sensors and gauges for slicing and lapping machines, back grinders and dicing saws, wafer shape (bow/warp) measurements, layer & pattern measurements, bump & groove measurements.

The semiconductor and semiconductor-like industries continue to produce ever smaller devices that are more complex in both shape and materials. For these purposes, Marposs has a complete range of non-contact sensors used for thin-film metrology, wafer dimensional characterization, wafer inspection, and packaging inspection. Its sensors can work inside automatic inspection machines to find defects and dimensional variation.

Here are some examples of how Marposs products can be of profitable use.

1-Solarius

Marposs has already announced the acquisition of Solarius Development Inc., a leading provider of high-tech manufacturing solutions for the consumer electronics and semiconductor industry. The new Phoenix Desktop 3D surface measuring system from Solarius enables highly accurate and precise 3D surface inspection. Phoenix expands the scope of application due to its extensive equipment, which supports, in particular, simple automation of the measurement tasks.

Phoenix Desktop 3D system is based on the Chromatic confocal technique dedicated to industrial environments, independent from ambient light, Sub-micrometric accuracy, and nanometric Axial resolution. In the design and calculation of the optics, great importance was attached to a physically optimal direction limitation of the optics, which allows for accurate, precise, and repeatable lateral measurements.

Phoenix features a comfortable and precise automated X/Y positioning unit with a 150mm x 150mm travel range and a height measuring range of 100m. The height measuring range can be adjusted up to 150mm in height using an accurate, manual traversing unit. Phoenix has six available sensor types with sensor heads of 45, 90, or 180 points of measure available, which are designed to meet the metrology required in mechanics, semiconductors, 3C, glass, automotive, aerospace, and medical.

2-NCG Thin Line

NCG is a distance/thickness measurement system based on interferometric technology: waves, which are reflected at the layer boundaries of different surfaces (two or even more in case of multilayer material) of the object being measured, are brought to interference, and the layer thickness is then calculated. The gauge has been designed to control the thickness of parts of different materials, such as, for instance, silicon, doped silicon, SiC, sapphire, GaN, glass, GaAs, SOI, plastic, and so on. Thanks to the infrared light sources, it is possible to measure non-transparent materials too. NCG can be equipped with different light emitters that cover multiple thickness ranges for each material, down to a lower limit of a few microns. A wide range of interferometric probes is available to fit both measurements performed in a clean environment but also in the harsh conditions typical of machine tools.

NCG is also equipped with a powerful measure elaboration SW able to provide a ‘clean’ measurement even in an optically noisy environment and also to efficiently track the measure of each single layer in case of multilayer materials that can be easily confused with each other. It can be used and programmed through a dedicated human interface that suits all offline applications. Moreover, measurement carried out by NCG can be forwarded to other machines (machine tools, complex measuring benches, or similar) through different protocols that are provided with a special SW package together with the electronic unit.

3-P3CF + Unimar

P3CF is a high-precision measurement system that combines chromatic confocal with touch measurement technology. The confocal probe is connected to the controller via a fiber optic cable. Different confocal probe models are available to fit both measurements performed in a clean environment but also in the harsh conditions typical of machine tools. Contact probes belong to the UNIMAR family, known for their versatility and reliability in any kind of machining.

P3CF is the ideal solution where it is necessary to provide an indirect thickness measurement. When direct thickness measurement is not possible because the material cannot be penetrated by standard NIR (near InfraRed) waves, the thickness of the target can be measured by getting the distance of the target through the confocal probe (avoiding touching it) and subtracting the distance of the support of the target detected with standard UNIMAR (the support is usually tough and often does not have good light reflectance, so the contact probe is the perfect solution).

P3CF can be used and programmed through a dedicated human interface that suits all offline applications.

Moreover, measurement carried out by P3CF can be forwarded to other machines (machine tools, complex measuring benches, or similar) through different protocols that are provided with a special SW package together with the electronic unit. For high-level integration in the factory network, the system also supports the most common types of Fieldbus.

For more information: www.marposs.com